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Semiconductor Composite Welding Head
Laser Welding Head

Semiconductor Composite Welding Head

Product Features:

This Semiconductor Composite welding head is an advanced welding solution featuring high efficiency, high weld quality, low deformation, and high joint strength. It is particularly advantageous for medium and thick plates, high-precision structures, and dissimilar/ composite material applications.

It offers deep penetration, aesthetically pleasing weld seams, a narrow heat-affected zone, minimal welding deformation, high joint strength, and a low defect rate, while maintaining both efficiency and assembly tolerance.

The internal structure of the welding head is fully sealed, preventing dust contamination of the optical components.

It is equipped with an air curtain system to reduce contamination of the optics from welding fumes and spatter residues.

The protective window adopts a drawer-type structure, making replacement quick and convenient.

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    Product size

    Product size

    Product parameters

    Product Name Semiconductor Composite Welding Head
    Fiber Interface QBH
    Laser Wavelength 915–980 nm; 1060–1080 nm
    Laser Power ≤ 3 kW
    Collimation F90 F100 / F150
    Focusing F250
    Protection Method Coaxial anti-collision + shielding gas
    Cooling Method Water cooling

    Application

    Laser marking

    Laser Marking

    laser cutting

    Laser engraving

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